Visitech Acquires Keynote Photonics: Week in Brief: 07/15/22

Northrop Grumman Corp. completed the preliminary design review for a high-energy laser prototype that will feature an architecture scalable to more than a megawatt for the U.S. Department of Defense. In March 2021, the U.S. Department of Defense awarded Northrop Grumman a $72 million contract under the High Energy Laser Scaling Initiative (HELSI) to demonstrate a high-energy laser prototype using Northrop Grumman’s coherent beam-combining technology. The company will test the prototype at progressively higher powers later this year to prove the coherent beam-combining design.

DALLAS — Visitech AS has acquired Keynote Photonics, a manufacturer of industrial projectors. The assets and staff will transition to new roles in the coming months. Existing Keynote production will be transitioned either to Visitech or third parties to ensure continuity of supply. Keynote Photonics has developed various DLP industrial solutions for customers in medical solutions, 3D scanning metrology, and advanced display systems that have been used in Olympic ceremonies, DNA analysis, and the first 8K laser TV.

From left: Adam Kunzman, Oyvind Tafjord, Amanda Kunzman, and Endre Kirkhorn. Courtesy of Visitech.

KFAR SABA, Israel — The MicroLED Industry Association has been established to help accelerate the adoption of microLED display technologies. Founding members include Coherent, PlayNitride, VueReal, Stratacache, ALLOS Semiconductors, Inziv, and QustomDot. The association will bring together companies, academia, and organizations in the microLED industry and will provide a forum to solve common technology issues, foster cooperation, and share relevant information, resources, and tools.

Bristol Instruments, Inc. - 872 Series LWM 10/24 MR

SAN JOSE, Calif., — Cadence Design Systems and Tower Semiconductor will collaborate to advance automotive and mobile integrated chip development. Through the collaboration, the companies will develop a comprehensive automotive reference design flow using the Cadence Virtuoso and Spectre Simulation Platform. The aim of the collaboration is to provide a faster design cycle while maintaining comprehensive design verification for advanced automotive integrated chip product development.

MUNICH — An investment fund under the management of AGIC Capital has invested an undisclosed amount into Eulitha AG, a provider of noncontact nano-UV-lithography equipment and services. Eulitha offers cost-efficient, noncontact, high-resolution photolithography systems and customized patterning service for applications including DFB/DBR lasers, AR/VR, telecommunications, optical components, and biosensors/chips.

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Published: July 2022

Glossary

semiconductor: A semiconductor is a type of material that has electrical conductivity between that of a conductor and an insulator. In other words, semiconductors have properties that are intermediate between metals (good conductors of electricity) and insulators (poor conductors of electricity). The conductivity of a semiconductor can be controlled and modified by factors such as temperature, impurities, or an applied electric field. The most common semiconductors are crystalline solids, and they are...
lithography: Lithography is a key process used in microfabrication and semiconductor manufacturing to create intricate patterns on the surface of substrates, typically silicon wafers. It involves the transfer of a desired pattern onto a photosensitive material called a resist, which is coated onto the substrate. The resist is then selectively exposed to light or other radiation using a mask or reticle that contains the pattern of interest. The lithography process can be broadly categorized into several...
photolithography: Photolithography is a key process in the manufacturing of semiconductor devices, integrated circuits, and microelectromechanical systems (MEMS). It is a photomechanical process used to transfer geometric patterns from a photomask or reticle to a photosensitive chemical photoresist on a substrate, typically a silicon wafer. The basic steps of photolithography include: Cleaning the substrate: The substrate, often a silicon wafer, is cleaned to remove any contaminants from its surface. ...
ultraviolet: That invisible region of the spectrum just beyond the violet end of the visible region. Wavelengths range from 1 to 400 nm.
chip: 1. A localized fracture at the end of a cleaved optical fiber or on a glass surface. 2. An integrated circuit.

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