Advanced process control technology developer Unity Semiconductor SAS (UnitySC) acquired 100 percent of the shares of HSEB Dresden GmbH, a supplier of optical inspection, review, and metrology for semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge process control solutions will provide a unique and essential inspection and metrology capability to semiconductor manufacturers. Together, the entity’s offerings span substrate, front-end-of-line manufacturing, wafer-level packaging, 3D integrated circuits, and power semiconductors. The combined product portfolio and future common platforms of UnitySC and HSEB will support manufacturing of devices used in mobility, automotive, and Internet of Things applications. Terms of the sale were not disclosed. “Thanks to the proprietary technologies developed by both companies, this strategic acquisition further strengthens our capacity for development and innovation, enabling us to be the preferred partner to meet new customer requirements,” said Patrick Leteurtre, president of UnitySC. “Our product portfolio now spans the spectrum required for substrate control of new front-end-of-line, advanced packaging applications, such as fan-out wafer-level packaging, embedded dies, and through-silicon vias, resulting in a value-added market positioning that will further accelerate our growth.” UnitySC is a provider of systems for inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with high depth-of-focus line scanning, temporal-mode interferometry, spectrometry, and phase-shift analysis. HSEB is a supplier of optical inspection systems for the semiconductor and MEMS industry.