Scott Pringle to Direct Sales at Indium

Scott Pringle was named sales director for global accounts at Indium Corp., the company announced today. Pringle has been a consultant with Indium for two years and has over 25 years of experience in the electronics market. He is based in southern California. Indium is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials, and of commercial grade and high-purity indium. It has headquarters in Clinton, N.Y., and factories in the US, UK, Singapore and China.

There are 11 suppliers of Thermal Interface Materials in the Photonics Marketplace.

Opto Diode Corp. - Detector Spotlight 10-24 MR

About Indium Corp.

Published: April 2007

Glossary

indium: Metal used in components of the crystalline semiconductor alloys indium gallium arsenide (InGaAs), indium gallium arsenide phosphide (InGaAsP), and the binary semiconductor indium phosphide (InP). The first two are lattice-matched to InP as the light-emitting medium for lasers or light-emitting diodes in the 1.06- to 1.7-µm range, and the last are used as a substrate and cladding layer.
photonics: The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
thermal interface materials: Thermal interface materials (TIMs) are substances or compounds used to enhance the thermal conductivity between two surfaces in contact. These materials are primarily employed in electronic devices, such as computer processors, LED lights, and power electronics, to facilitate the efficient dissipation of heat generated during operation. The main purpose of TIMs is to reduce the thermal resistance at the interface between the heat-generating component and the heat sink or cooling solution. ...

Browse Cameras & Imaging, Lasers, Optical Components, Test & Measurement, and more.

BiophotonicsEmploymentindiumNews BriefsphotonicsPhotonics SpectraPhotonics Tech Briefsprinted circuit board assemblysemiconductor packagingsolder productsthermal interface materials

November 2024 Subscribe Advertise
Issue Library