Semiconductor Equipment Corp. (SEC) of Moorpark, Calif., will distribute the Yamaha i-Cube II high-speed automatic die mounter in Mexico and North America under a contract with Tsuneji Togami, director of Yamaha Motor Co. Ltd. and president of its Intelligent Machinery Div. The i-Cube II instrument, which can handle surface-mount devices and semiconductor components that are mounted in mixture, complements SEC's product line, which includes manual and semiautomatic die bonders, flip-chip placement and bonding systems, laser diode and eutectic die bonders, and pick-and-place systems. Yamaha Motor is headquartered in Iwata, Japan.