Trapped ion-based quantum computing company IonQ reported its demonstration of remote ion-ion entanglement. In the demonstration, the company entangled two trapped ion qubits from separate trap wells by using entangled photons. The undertaking was enabled with a system to collect photons from two trap wells and routing them to a single detection hub. The company sees the development as a next step forward in scaling its quantum systems and developing photonic interconnects. The ZEISS Innovation Hub in Dresden, Germany, in which the recently opened semiconductor applications lab is located. Courtesy of ZEISS. DRESDEN, Germany — ZEISS opened its ZEISS Microscopy semiconductor applications lab in Dresden, Germany. The facility is located within the ZEISS Innovation Hub opened in May. The company said that the lab will address increased automation of microscopy workflows and techniques to help the semiconductor industry accelerate root cause analysis and pathfinding for challenges in microelectronics.. ROME — Microscopy solutions manufacturer CrestOptics S.p.A. entered into a collaboration with Leica Microsystems to offer CrestOptics’ CICERO spinning disk unit within Leica’s THUNDER Imager Cell Spinning Disk system. CICERO’s design centers around epifluorescence and confocal microscopy for imaging applications, such as the capture of fast cellular events like chromosome segregation and organelle trafficking. The integration brings together THUNDER’s proprietary computational clearing technology with Leica’s DMi8 microscope for features including an automated sample finder and adaptive immersion technology. TEMPE, Ariz. — Amkor Technology, Inc., an outsourced semiconductor assembly and test service provider, signed a memorandum of understanding with TSMC to collaborate and bring packaging and test capabilities to Arizona. Under the agreement, TSMC will contract turnkey packaging and test services from Amkor in their planned facility in Peoria, Arizona, outside Phoenix. TSMC will leverage these services to support its customers, particularly those using TSMC’s wafer fabrication facilities in Phoenix. The companies will jointly define the specific packaging technologies, such as TSMC’s integrated fan-out and chip on wafer on substrate that will be employed to address common customers’ needs. Alpine Laser’s acquisition will help to accelerate Machine Solutions product development. Courtesy of Machine Solutions. FLAGSTAFF, Ariz. — Machine Solutions, Inc., a provider of equipment and services for the medical device market acquired laser processing solutions company Alpine Laser LLC. Financial terms of Machine Solutions’ acquisition of the precision laser technology for medical device manufacturing were not disclosed. Inside view of the laser application lab in Budapest, Hungary. Courtesy of Furukawa Electric Co., Ltd. BUDAPEST, Hungary — Furukawa Electric Co., Ltd. opened a laser application laboratory in Budapest, Hungary, inside its subsidiary Furukawa Electric Institute of Technology Ltd. The facility will provide laser welding solutions to automotive component companies that develop and produce components for e-mobility. DENVER — Optomechanical system instrumentation developer Officina Stellare signed a letter of intent with space multi-orbit data transport services company Skyloom Global to establish a joint venture, based in the Veneto region of Italy, named Skyloom Europe. The collaboration will focus on the manufacturing of optical communication terminals for advanced encryption techniques using quantum coding for airborne and space applications, such as multi-orbit satellite network services. ORLANDO, Fla. — Laser Photonics Corporation moved its headquarters to a 50,000 sq ft facility that will house the company's sales and marketing department, as well as engineering and R&D departments. CAMBRIDGE, Mass. — Life science company Vizgen is merging with multiplex proteomic biomarker detection company Ultivue, Inc. to establish a single organization for developing future technology and solutions in spatial multiomics. Rob Carson, former CEO of Ultivue, will become president and CEO of Vizgen. Terry Lo, who has served as Vizgen’s CEO beginning in 2020, will continue to serve as a member of the board of directors. Concurrent with the merger, Vizgen completed a Series D round of new equity financing. DuPont’s new building for photoresist production at its Sasakami site in Niigata, Japan. Courtesy of DuPont. NIIGATA, Japan — DuPont completed the expansion of its Sasakami site in Agano-shi, Niigata, Japan. The new building features cleanrooms with air cleanliness standards ranging from ISO Class 10 to Class 1000 for the production of photoresists. With this expansion, DuPont reports that it has nearly doubled its photoresist production capacity at the site.