SOI, GaN, GaAs and InP, and MEMS semiconductor technologies may be combined together, with each being optimized for particular functional requirements, thanks to a new licensing agreement between X-FAB Silicon Photonics and X-Celeprint. Courtesy of X-FAB. X-FAB Silicon Foundries, a foundry for analog/mixed signal and specialty semiconductor solutions, is now able to support volume heterogeneous integration. X-FAB secured a licensing agreement with X-Celeprint, which allows it to support volume heterogeneous integration via Micro-Transfer Printing (MTP). The capability enables the combination of a broad range of semiconductor technologies, with each optimized for particular functional requirements. These will include SOI, GaN, GaAs, and InP, as well as MEMS. X-FAB has been taking measures over the past two years to prepare itself for this capability through investments, as well as the establishment of optimized workflows and cleanroom protocols. Through these measures, it seeks to enable heterogeneous design products to be developed with low-risk and with the ability to scale to volume production, X-FAB said. X-Celeprint’s proprietary massively parallel pick-and-place MTP technology stacks and fans out ultrathin dies based on different process nodes, technologies, and wafer sizes. It results in the formation of virtually monolithic 3D stacked ICs, which have better performance, greater power efficiency, and a more compact form. “High-volume heterogeneous integration of elements derived from various different source wafers will provide the semiconductor industry with significant new capabilities, including access to higher density devices with more functionality, fabricated at high yields and lower cost, within shorter timeframes,” Kyle Benkendorfer, X-Celeprint’s CEO, said.