The Ballistic Missile Defense Organization has contracted with Summit Imaging Inc. of Colorado Springs, Colo., to develop a MEMS inspection device based on a high-performance CCD imaging system. Because MEMS are three-dimensional, with features tens or hundreds of microns above or below the silicon surface, only a small portion can be in focus at a time. The system being tested combines a high-frame-rate, low-noise camera with wavefront coded optics to increase depth of focus.