CANTON, Mass., July 27 -- Robotic Vision Systems Inc. has received a multiunit order for the company's new WS-2500 Wafer Inspection System from a major US-based microprocessor manufacturer. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multiprocess gold bumps. The WS-2500 is designed to handle the industry's standard 200 mm wafers, while the new WS-3000 inspects the semiconductor industry's new 300 mm wafers. The WS-2500 combines RVSI's proprietary high-speed 3-D laser technology with 2-D high resolution, state-of-the-art cameras. A sophisticated user interface and software allow for fast and easy set-up of new wafers to minimize programming time.