Optoscribe, a supplier of 3D glass-based integrated photonics components, and Sumitomo Electric, an optical fiber cable and component manufacturing technology supplier, have formed a strategic cooperation to provide multicore fiber components for datacom and telecom applications. Optoscribe’s 3D glass-based photonic integrated circuits combine embedded waveguides and high-precision micromachining for applications ranging from data center optical transceiver interconnects, to fiber connectivity and consumer electronics. This strategic cooperation will seed the market for practical use cases of Sumitomo Electric’s MCF interconnects. This is especially true in regards to four-core (or greater) MCFs with fan-in/fan-out components based on 3D glass-based photonic technology in datacom applications where ultrahigh density optical interconnect is required.