!%Rudolph Technologies Inc.%! of Flanders, N.J., a process characterization equipment and software provider, has received $5 million worth of orders from a long-standing customer for its S3000A and MetaPulse III thin-film metrology systems. Expected to ship to multiple fabs in the first half of 2010, the systems will be used in copper metrology applications, including copper seed/barrier, electrochemical deposition and chemical mechanical polishing. The MetaPulse III can directly measure thickness and other metrology parameters on product wafers in the active device regions for accurate process control.