Photonic technologies will feature prominently at the 2024 IEEE Electronic Components and Technology Conference (ECTC) taking place May 28-31 at Denver’s Gaylord Rockies Resort and Convention Center. The event covers microelectronics packaging and component science and technology. According to Michael Mayer, ECTC Program Chair and a professor at the University of Waterloo, one of the major focuses of the conference will be technologies enabling heterogenous integration and photonics. Among the photonics topics being discussed are copackaged optics, optical interconnection, and photonics integration, materials, and processes. Keynoting the event will be Keren Bergman of Columbia University who will present a talk titled "Petascale Photonic Chip Connectivity for Energy-Efficient AI Computing." The event will feature more than 375 technical papers, special topic sessions and other events, including professional development courses, panel discussions, and presentations. For further information, visit www.ectc.net/index.cfm.