PVA TePla, a provider of high-tech solutions for materials and measurement technology, has acquired DIVE imaging systems GmbH, a provider of light microscopy systems for analyzing surfaces and layer thicknesses. The integration of DIVE expands PVA TePla’s portfolio with additional technologies for high-precision, fast, and non-destructive inspection. Terms of the transaction were not disclosed.

DIVE was founded in 2023 as a spin-off of the Fraunhofer Institute for Material and Beam Technology IWS (Fraunhofer IWS). The company’s hyperspectral vision technology, supported by AI, enables precise and non-destructive material analysis of key components for the production of microchips and fuel cells. The technology can be used to examine surface properties, determine layer thicknesses, and detect defects and impurities.