The Optical Internetworking Forum (OIF) has published an implementation agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach. According to Alphawave Semi's Matt Brown, who served as editor of the CEI-112G-XSR+-PAM4 IA, the agreement addresses a gap in OIF CEI specifications to cover new applications identified by OIF’s membership. The agreement specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect with bump-to-bump insertion loss of up to 13 dB at the Nyquist frequency and baud rate in the range 36 to 58 Gsym/s. The intended applications encompass multiple-chip modules, co-packaged optics, and near-package optics assemblies. It also details the requirements for the CEI-112G-XSR+-PAM4 extended extra short reach high-speed electrical interface with nominal baud rates between 36 and 58 Gsym/s using PAM4 modulation. “The CEI-112G-XSR+-PAM4 IA represents a significant milestone, extending the reach of previously published XSR class specifications at this speed range,” said Kandou Bus S.A.'s David Stauffer, OIF Physical and Link Layer Working Group Chair. “This IA empowers advanced interconnectivity solutions in die-to-die and die-to-optical-engine scenarios, supporting baud rates up to 112 Gb/s (58 Gsym/s). These specifications have the opportunity to revolutionize multiple-chip modules, co-packaged optics, and near-package optics applications, pushing the boundaries of high-speed data transmission.” In addition to the unveiling, OIF said that it recently released the Coherent Common Management Interface Specification (C-CMIS) IA 1.3; published an application of artificial to enhanced network operations technical white paper; published the ECOC 400ZR+ demo white paper; and launched a series of CMIS technical webinars.