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Nextreme Funds Heat Transfer Research

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Nextreme Thermal Solutions of Research Triangle Park, N.C., has provided more than CAN $300,000 for research at the Microelectronics Heat Transfer Lab at the University of Waterloo in Ontario, Canada. The research will integrate the company’s thermoelectric component technology into applications including system-level thermal management and power generation. The North Carolina company is a manufacturer of thermoelectric components for the semiconductor, photonics, and defense and aerospace industries.
Teledyne DALSA - Linea HS2 11/24 MR

Published: July 2007
Businessdefenselight speedMicroelectronics Heat Transfer LabNextreme Thermal Solutions

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