NACL Acquires Optical Filter Source

MENTOR, Ohio, April 11, 2024 — North American Coating Laboratories (NACL) has acquired Optical Filter Source, LLC. Both companies provide optical coating services to industry professionals working with optical components from UV to the FIR. The acquisition brings new capabilities including photolithography, busbar application, dicing, and sputtering technology.

The combined companies will have 15 coating chambers and approximately 42 employees operating in two locations, one being NACL's existing facility outside Cleveland. Following the transaction, Optical Filter Source's Round Rock, Texas, location will be named OFS by NACL, LLC and continue to operate as Optical Filter Source. NACL’s Brian Wilson will serve as CEO and current Optical Filter Source CEO Frank Calcagni will serve as president of the combined company.

Terms of the deal were not disclosed.

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About North American Coating Laboratories

About OFS by NACL LLC

Published: April 2024

Glossary

infrared: Infrared (IR) refers to the region of the electromagnetic spectrum with wavelengths longer than those of visible light, but shorter than those of microwaves. The infrared spectrum spans wavelengths roughly between 700 nanometers (nm) and 1 millimeter (mm). It is divided into three main subcategories: Near-infrared (NIR): Wavelengths from approximately 700 nm to 1.4 micrometers (µm). Near-infrared light is often used in telecommunications, as well as in various imaging and sensing...
polymer: Polymers are large molecules composed of repeating structural units called monomers. These monomers are chemically bonded together to form long chains or networks, creating a macromolecular structure. The process of linking monomers together is known as polymerization. Polymers can be classified into several categories based on their structure, properties, and mode of synthesis. Some common types of polymers include: Synthetic polymers: These are human-made polymers produced through...
photolithography: Photolithography is a key process in the manufacturing of semiconductor devices, integrated circuits, and microelectromechanical systems (MEMS). It is a photomechanical process used to transfer geometric patterns from a photomask or reticle to a photosensitive chemical photoresist on a substrate, typically a silicon wafer. The basic steps of photolithography include: Cleaning the substrate: The substrate, often a silicon wafer, is cleaned to remove any contaminants from its surface. ...
sputtering: A vacuum deposition method in which the coating material (target) is removed from the surface of the coating source (cathode) by ion bombardment and deposited upon the substrates.

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