Indium Hosts Global Technical Summit
Forty technical support and applications engineers attended Indium Corp.'s 4th Annual Global Technical Summit, held last month in Clinton, N.Y. Participants from Asia, Europe, Mexico and the US learned about new products, current research and developments in the industry, and presented case studies and shared their expertise. The agenda also included presentations by Claudius Ferger, manager of advanced plastic packaging at IBM’s Thomas J. Watson Research Center; Ning-Cheng Lee, Indium's vice president of technology; and Ronald C. Lasky, senior technologist at Indium. Indium is a supplier of electronics and semiconductor assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials. The company is also a major supplier of commercial-grade and high-purity indium.
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