The Optical Internetworking Forum (OIF) has unveiled the External Laser Small Form-Factor Pluggable (ELSFP) Implementation Agreement (IA). The IA introduces a multisourced future-proof front panel pluggable external laser source form factor, which represents the first available to industry. The IA includes definitions for the placement of laser sources at the front panel — the coolest section of a co-packaged optical system — enhancing system reliability and allowing for efficient “hot-swap” field replacement when necessary. The front panel pluggable form factor introduced by the IA is tailored for other multiple laser external laser source applications in addition to co-packaged optical systems. The ELSFP uses a multifiber blind-mate optical connector positioned at the rear of the module. This design mitigates potential eye-safety risks, particularly in applications where high optical powers are involved. Each ELSFP can supply optical power to one or more optical engines, all managed by OIF’s common management interface specification. In addition, the IA defines interoperability for mechanical, thermal, electrical, and optical parameters, as well as establishing standard power ranges and fiber configurations to focus the industry’s development. A pass-through option allows systems architects to maximize face plate real estate. According to Jeff Hutchins, OIF board member and Physical & Link Layer Working Group co-packaging vice chair and board member at Ranovus, the ELSFP’s design enables seamless integration with OIF’s 3.2T co-packaged optical module project. The OIF established the OIF Co-Packaging 3.2T Co-Packaged Module IA in April as the industry’s first co-packaging standard and first project under the umbrella of its Co-Packaging Framework Document.