The electronics group of Henkel Corp. has established a 53,000-sq-ft facility in Irvine, Calif., to house both research and development and applications engineering for its die attach, semiconductor underfill, encapsulant and semiconductor mold compound products.

After its planned opening Feb. 21, the center will serve as global headquarters for the group. It is equipped with an analytical and failure analysis lab for developing materials for electronics assembly and semiconductor packaging. Also part of the operation are a 5000-sq-ft Class 10,000 cleanroom containing semiconductor production equipment and a 2000-sq-ft surface-mount production line with screen printing, reflow and dispensing capabilities.