GlobalFoundries to Create New York Advanced Packaging and Photonics Center
MALTA, N.Y., Jan. 20, 2025 — GlobalFoundries (GF) will create a center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by investments from the State of New York and the U.S. Department of Commerce, the center aims to enable semiconductors to be securely manufactured, processed, packaged, and tested entirely onshore to meet the growing demand for silicon photonics and other essential chips for critical end markets including AI, automotive, aerospace, defense, and communications.
The facility is expected to offer advanced packaging, assembly, and testing for GF’s differentiated silicon photonics platform. The center will also provide new production capabilities for the advanced packaging, wafer-to-wafer bonding, assembly, and testing of 3D and heterogeneously integrated chips using 12LP+, 22FDX, and other platforms.
The site benefits from Trusted Foundry accreditation, which allows it to manufacture secure chips in partnership with the U.S. Government. GF expects to provide full turnkey advanced packaging, bump, assembly, and testing for aerospace and defense customers. Across the semiconductor industry, most advanced packaging today takes place in Asia.
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in R&D over the next 10-plus years. New York State will provide up to $20 million in new support for the new center, which is in addition to the previously announced $550 million in support for GF from the New York State Green CHIPS program. The U.S. Department of Commerce will provide up to $75 million in direct funding to support the center, supplementing the previously announced GF award under the CHIPS and Science Act.
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