Search
Menu
Teledyne DALSA - Linea HS2 11/24 LB

Glass Structuring Agreement

Facebook X LinkedIn Email
MSG Lithoglas AG of Berlin has signed an agreement with Schott AG of Mainz, Germany, for exclusive use of the latter’s process and application intellectual property on the additive structuring of glass. This technology enables the deposition of thin borosilicate glass layers at low temperatures and allows for hermetic packaging on the wafer level – yielding reliable, robust and biocompatible passivation at low cost.
Spectrogon US - Optical Filters 2024 MR

Published: April 2009
Businesslight speedMSG LithoglasResearch & TechnologyWafers

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.