ShunYun Technology, an optical transceiver manufacturer, and NewPhotonics, an integrated photonics manufacturer, announced a strategic partnership for volume manufacturing of the NewPhotonics NPG product line. ShunYun will provide full functional wafer and photonics integrated circuit level test and laser burn-in at both volume and new-product introduction. NewPhotonics is preparing for high-volume manufacturing of the NPG PIC transmitter on chips for 1.6T digital signal processor (DSP)-based transceivers and the 800G and 1.6 T linear pluggable optics (LPO)+ optical signal processing chips.
SAN JOSE, Calif. — POET and optical semiconductor supplier Siver Semiconductor entered into a collaboration to develop a high-performance external light source module for co-packaged optics and AI infrastructure. The collaboration will use Sivers' customized high-power distributed feedback (DFB) laser technology and POET’s optical imposer platform for an integrated and cost-optimized solution, the companies said. The developed modules will use wafer-level manufacturing and chip-scale photonics integration to scale out and scale up deployments, such as cost, scale, and form factor. POET and Sivers expect to demonstrate early prototypes to customers in the first half of 2026 and production readiness by the end of 2026.
SAN JOSE, Calif. — ALchip and Ayar Labs announced a collaboration focused on the design a co-packaged optics solution for AI datacenter scale-ups. The design reduces system stall times, enabling high-performance AI clusters. The joint solution features Ayar Labs’ TeraPHY optical engines co-packaged with ALchip’s solutions on a common substrate, bringing optical I/O directly to the AI accelerator interface. This integration enables more than 100 Tbps of scale-up bandwidth per accelerator and supports more than 256 optical scale-up ports per device. The solution enables multi-rack network scale-up without the power and latency of pluggable optics by minimizing electrical trace lengths and placing optical connections close to the compute core.
C-PIC’s silicon wafer. Courtesy of C-PIC.
SOUTHAMPTON, England — CORNERSTONE Photonics Innovation Center (C-PIC), a silicon photonics innovation and knowledge center, released Open Platform, which enables open-source collaboration for researchers and industry. The open-source collaboration makes C-PIC’s foundry-compatible silicon photonics process design kits, components, and building blocks available via its Open Platform GitHub. The platform will support community contributions, allowing researchers, individuals, and organizations to upload and reuse design elements. C-PIC released the SOI 220 nm active process design kit (PDK) silicon-on-insulator (SOI) platform and SiN 300 nm PDK – silicon nitride platform. Contributors include CSA Catapult, Tyndall National Institute, and individuals from leading universities such as the University of Pavia, and the University of Sheffield.
EINDHOVEN, Netherlands — Photon Bridge collaborated with PICadvanced to prototype transceivers built using its multi-material integrated photonics platform. The prototype uses Photon Bridge’s cantilever waveguide coupling technology. The platform uses the speed of III-V materials with the scale of silicon photonics, enabling compact, integrated optical engines. Photon Bridge PIC has been integrated into prototype pluggable transceivers targeting the passive optical networks market. PICadvanced will use the solution to evaluate and develop a highly competitive pluggable module. This collaboration is part of Photon Bridge’s transition from development into customer-driven prototypes. The move comes following Photon Bridge's rebrand announced earlier this week.
Research underway at NLM Photonics. Courtesy of NLM Photonics.
SEATTLE — NLM Photonics, a hybrid organic electro-optic technology company, announced validation results from third-party testing of multi-channel silicon-organic hybrid (SOH) PICs capable of 1.6 T and 3.2 T performance. In addition to this, the 1.6T SOH PIC technology achieved 224 Gb/s per channel data transmission in tests. According to the company, its testing set a world record SOH modulation efficiency of 0.31 V-mm (on single channel) representing a 10x-15x improvement over traditional silicon photonic modulators. In bandwidth testing performed by VLC Photonics, the technology delivered 3 dB bandwidths exceeding 80 GHz for 200G components and up to 110 GHz for 400G components. The PICs tested were designed in collaboration with enosemi and fabricated on Advanced Micro Foundry’s O-band GP v4.5 200-mm silicon photonics platform to specifications developed by Centera Photonics.
COPENHAGEN, Denmark — The LPO MSA group released a 100 Gb/s per lane linear pluggable optics 400G-FR4-LPO single-mode optical data transmission specification for 400 Gb ethernet connectivity over four wavelength division multiplex lanes. The LPO MSA is a group composed of more than 50 networking, semiconductor, and optics companies. This specification supports reaches up to at least 500 m over a pair of single-mode fibers and meets the optical and electrical requirements for an ecosystem of LPO-compatible switch, network interface cards, and module products for wavelength division multiplexing infrastructure. With the completion of this second 100 Gb/s per lane specification, the LPO MSA has started efforts on 200 Gb/s per lane linear implementations and plans to work with development organizations such as OIF and IEEE.
Genuine Optics’CEO Madhav Bhatta (left) and Innolume CEO Alexey Kovsh sign a memorandum of understanding. Courtesy of Genuine Optics.
COPENHAGEN, Denmark — Quantum dot laser technology company Innolume and optics supplier Genuine Optics signed a memorandum of understanding to collaborate on high-reliability quantum dot-based 1.6T/s modules. The partnership aims to release 1.6T quantum dot-based transceivers and co-develop 1.6T quantum dot-based transceivers modules. The partnership will focus on serving cloud service providers, data center operators, and network equipment manufacturers.