NATICK, Mass., Aug. 22 -- Cognex Corp. announced that it has made an OEM agreement with Samsung Techwin of Seoul, Korea. According to the two-year agreement, Samsung Techwin will buy more than $1 million worth of Cognex machine vision systems to be used in its wire bonders, which are automated machines that guide the connection of ultra-thin wires from semiconductor dies to leadframes.
The Cognex systems are useful because they are able to mechanically see where the connections between the die and the leadframe need to go, and then give that data to the wire bonder.
Samsung Techwin is a unit of Samsung International. The company manufactures capital equipment for the semiconductor, digital imaging, aviation, and defense industries. Cognex designs and markets machine vision systems.