NATICK, Mass., Aug. 9 -- Cognex Corp. has received more than $13 million in orders for its machine vision systems from Shinkawa Ltd., the Japan-based manufacturer of wire and die bonding equipment for the semiconductor industry.
Shinkawa has ordered more than $30 million worth of Cognex products in the past 14 months, but this is the single biggest order Cognex has received to date. The second biggest was a $12 million order from Shinkawa just last year. Cognex will complete shipment of the systems by next spring, the company said.
Cognex and Shinkawa have established a strong business relationship over the past 11 years, and we are delighted to continue helping them meet their customers' needs, said Dr. Robert J. Shillman, president, CEO, and chairman of Cognex. This substantial order is a clear indication that demand remains very strong for our customers in the semiconductor capital equipment industry.
Cognex vision systems are used during the manufacture of semiconductor chips to connect and assemble semiconductor die to lead frames and other substrates. The systems steer and control the bonding process by visually determining where the connections between the die and lead frame are to be made.