AMD Acquires Enosemi to Advance Co-Packaged Optics Capabilities
SANTA CLARA, Calif., May 29, 2025 — AMD has acquired silicon photonics startup Enosemi to scale its ability to support and develop co-packaged optics solutions across next-gen AI systems. Financial terms of the acquisitions were not disclosed.
“Enosemi has a proven track record of building and shipping photonic circuits in volume, a feat that few select teams have accomplished,” said Brian Amick, senior vice president of technology and engineering at AMD. Enosemi has collaborated with AMD as an external development partner on photonics projects.
Enosemi, which emerged from stealth in 2023, has existing 1.6 Tbit/s photonic chiplets and design IP. The company uses a 300-mm wafer manufacturing process, and last year made available a portfolio of high-speed IP in the GlobalFoundries Fotonix IP platform. Enosemi partnered with Jabil earlier this year to develop advanced packaging process technology for photonic chips.
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