Representatives of Toyota, Kobe Steel, JFE, Nippon Steel, Hamamatsu, Matsushita, Panasonic, Osaka University, Technical Institute of Tokyo, Nipponese University and the Japanese National Aerospace Laboratory, were among 53 who attended the 3rd Japanese Forum on Thermography held recently in Yokohama, Japan. The event was organized by Cedip Infrared Systems, a France-based thermal IR technology developer. Hiroyuki Terada, an official with the Japan Aerospace Technology Foundation, reviewed the present state of thermographic technologies and discussed the benefits that could arise from likely developments. Takahid Sakagami, a mechanical engineering faculty member at Osaka University, presented a talk on detection of stress corrosion cracking by the sonic-infrared method. He described progress made by the Japanese Society for Non-Destructive Inspection (JSNDI) in defining a standard (NDIS 3425) for thermoelastic stress measurement. Other topics at the meeting included reverse analysis of stress images using a new hybrid stress analysis program, nondestructive thermography using the Edevis system and developments in thermography and stress analysis from Cedip Infrared Systems.