Oct. 29, 2024
Laser Micromachining
Laser micromachining continues to revolutionize the modern manufacturing environment. Contributing editor Andreas Thoss takes stock of the methods, protocols, and systems behind this enduring trend, and closely examines some drivers to improving efficiencies. Performance gains in both ultrashort-pulse systems and laser scanners, as well as novel and improving schemes for beam optimization, are spearheading momentum in this facet of laser materials processing. At the same time, the effective use of these systems for a range of distinct functions -- micro-drilling, micro-cutting, and micro-engraving -- are leading engineers and manufacturers to seek improved efficiencies, both in-process and overall.
Key Technologies: Laser Micromachining (Micro-Drilling, Micro-Cutting, Micro-engraving), Laser Scanners, Laser Texturing and Patterning, Laser Amplifiers, Beam Profiling
PICs
Integrated photonics is a transformative force across industries, offering unprecedented advancements in data processing speed, energy efficiency, and miniaturization. This article provides an in-depth exploration of the integrated photonics ecosystem, highlighting the roles of key stakeholders from research institutions and material providers to the producers and end-users. It examines the technological landscape, including silicon photonics, indium phosphide, and other emerging platforms, while addressing the complexities of the supply chain, from wafer production to advanced packaging and testing. The discussion extends to market trends, emphasizing the adoption of integrated photonics in various markets like telecommunications, automotive, healthcare, and quantum computing, among other sectors. And, amid technical and geopolitical challenges, the article identifies opportunities for growth through collaborative ecosystems, government initiatives, and standardization efforts. Concluding with strategic recommendations for stakeholders, this article envisions a future where integrated photonics drives innovation and propels industries toward new frontiers, underscoring the importance of collaboration and strategic development in realizing its full potential.
Key Technologies: Silicon and Integrated Photonics, PICs, PICs Packaging, Chip Fabrication, Lithography, Design-for-Test, Optical Datacom, Data Processing, PIC Design, Photonic Computing, Integrated DFB Lasers, PIC Material Platforms (silicon, silicon nitride, indium phosphide), Integrated Photonic Components (DBRs, Optical Waveguides, Phase and Intensity Modulators, Photodetectors)
Micro-Optics
With miniaturization permeating all reaches of manufacturing, from conceptualization all the way through to product development, it is no surprise that, in the optics domain, optical elements are shrinking in size. Beyond durability and advanced applications, smaller systems and devices -- fabricated from smaller optical components and elements -- are opening the door to improved performance in existing applications as well as entirely new use cases. Manufacturing protocols and methods are drivers to the widespread development of micro-optics, streamlining their mass-producibility and adoption into numerous types of systems. But beyond manufacturing, prototyping and packaging are also key enablers to applications; the ability to test, measure, and characterize components is essential to streamlined manufacturing and scale production. This article explores the full micro-optics value chain – from characterization and testing, to manufacturing and development, to packaging, and ultimately application.
Key Technologies: Micro-Optics Manufacturing (both methods and sources: Methods = Nanoimprint and Photolithography; Sources = VCSELs, Diode Lasers, Excimer Lasers), Micro-Optical Metrology (Characterization), Designing Micro-Optics, Micro-Optical Components (DOEs, Microlenses, Nanogratings, Diffusers), Micro-Optics Market Update, Interferometry
Drone-Based Sensing
Today, drones are ubiquitous for climate/environmental monitoring, and are widely deployed in aersopace, defense, and military settings. While photonics technologies and products enable end-users to perform these applications, incorporating these systems into a drone often serves to maximize the potential to achieve improved levels of performance, and in a wide range of environments. With a focus on applications for optical sensing (multispectral, navigation/position sensing, chemical sensing, and more) contributing editor Michael Eisenstein explores the optimization of drone architectures in situations in which a photonic sensing element may be utilized. Additional considerations are given to the integration of sensing systems into the drone architecture, AI adoption, and ultrafast processing capabilities.
Key Technologies: Remote Sensing, Chemical and Gas Sensing, Hyperspectral Imagining, Thermal Imaging, Camera Integration, Navigation/Directional Sensing, Multispectral, Agri-Sensing, Point Clouds, Thermal Sensors, Lidar
Quantum Optics
Advanced quantum applications including those in networking, sensing, encryption, and computing, are reliant on fundamental optical and photonic components and principals, including photon sources and entanglement, as well as polarization control. Still, advancing applications often requires enhancing existing concepts -- and the quantum realm is no exception. Contributing editor Andreas Thoss isolates the role of several essential quantum components and applications, framing them in the context of the road to commercial solutions for functions like cybersecurity and QKD. The article additionally explores the role of advanced photon sources and quantum optical systems in achieving data security in/from quantum communication and heightened information processing capacity in quantum computing.
Key Technologies: Quantum Optics, Quantum Communication, Quantum Sensing, QKD systems for fiber networks and satellites, Entangled Photon Sources, Quantum Computing and Machine Learning, Quantum Repeaters, Single Photon Sources
Nano-Positioning
In semiconductor and electronics manufacturing, the drive for miniaturization seems to be constant and limitless, both for components and finished devices. For structures in the nanometer size range, it is important to optimally adapt positioning technology to the respective production process. Intelligent solutions in nanopositioning technology support these necessary adaptations, but are not without their own bottlenecks. Logically, the positioning accuracy must be even more fine-grained than the structures themselves. A further challenge lies in reconciling the required precision and manufacturing quality of the respective process steps with the planned throughput. Finally, automated systems in wafer production and inspection usually must operate 24/7 and therefore place high demands on system availability. MKS Newports explores critical positioning system parameters in nanopositioning, the challenges of positioning within vacuum chambers, considerations when choosing air-bearing positioning systems, and adjustments needed to improve overall performance (e.g. wafer chucks, interferometers vs linear encoders, and active alignment).
Key Technologies:Nano-Positioning, Positioning Equipment, Semiconductor and Consumer Electronics Manufacturing, Wafer Inspection, Semiconductor Metrology, Air-Bearing Stages, Mechanical Stages, XY Stages, Precision Motion, Motion Control, Interferometry
Silicon Photonics
The exponential growth in data communication, fueled by advancements in AI, ML, cloud computing, AR/VR, VOD, 5G, IoT, and autonomous driving, is leading to unprecedented demand for increased bandwidth in hyperscale data centers. To address this, the industry is witnessing a pivotal shift from 800G to 1.6T/32.T optical transceiver modules, effectively doubling/quadrupling the bandwidth capacity per rack unit without necessitating infrastructure changes. This article explores the role of silicon photonics in this transformation, highlighting its impact on the design and manufacturing of optical transceivers. With industry now providing advanced integrated laser sources, and innovating advanced manufacturing processes, industry is reaching new standards for reliability, scalability, and cost-effectiveness in optical networking. This article also discusses the challenges and solutions in implementing high-speed optical transceivers, including power consumption, cooling, and the integration of optics with ASICs, OCI, & CPO. The future of data center connectivity is poised for significant advancements as technology enables the mass production of leading-edge transceivers, paving the way for the next generation of high-performance computing and AI infrastructure.
Key Technologies: Integrated Photonics, PICs, Silicon Photonics, Optical Transceivers, Pluggables, Optical Interconnects, Mach-Zender Modulators, Ring Modulators, Co-Packaged Optics, Optical Switching, Optical Networks, Electro-absorption Modulators, DFB Lasers, Optics and the Data Center, Integrated Lasers, Optical I/O, Optical Computing
Nonvisible Imaging
For inspections in industrial, manufacturing, and life science environments, demand for for higher throughputs, wider fields, and lower temperatures are serving to broaden the utility of microscopy imaging and open new areas of application. As use cases expand, the need for solutions outside the visible -- using IR, UV and THz wavelengths -- is entering the mainstream of modern manufacturing. Infrared imaging modalities, including Fourier-transform, IR spectrophotometry, SWIR microscopy, IR broadband spectroscopy; UV microscopy and spectroscopy; and THz microscopy are among the solutions finding use. Applications range from surface inspection, battery analysis, and semiconductor defect detection, to counterfeit prevention, medical device inspection, and quantum computations.
Key Technologies: IR Microscopy (FTIR and SWIR), Microspectrophotometry, FTIR Imaging, QCLs, UV Spectroscopy, UV Microscopy, UV Sources, Confocal Mapping Microscopy, THz Microscopy, Surface Characterization (using microscopy), Quantum Imaging
Industry Insights: Laser Micromachining
In his report from EPIC's Technology Meeting on Laser Microprocessing in Vilnius, Lithuania, contributing editor Andreas Thoss peels back the layers on Lithuania's burgeoning laser community, speaking with key players in the sector and tracing the roots of the nation's aptitude in laser technology back to the 1970s and a one-of-a-kind tradition that remains in place today. Thoss additionally identifies key themes in laser micromachining, and laser materials processing more broadly, speaking with industry leaders and ascending companies from across the technology space.
Key Technologies: Laser Micromachining, Laser Materials Processing (general), Industrial Lasers, Laser Drilling, Beam Shaping, Laser Dicing, Laser Materials Processing for automotive parts manufacturing, UV sources (for industrial applications), Laser Texturing, Ultrashort-Pulse Lasers (for industrial applications)
Photonic Fundamentals: CaF2 Optics
The rise of hyperscale data centers, paired with AI, EVs, smart grids, and smarter consumer electronic devices are fueling demand for more computing power – in turn driving the need for more efficient power consumption. In this context, and in addition to key components, crystalline calcium fluoride (CaF2) materials are commonly favored for ArF (193 nm) laser-based micro-fabrication in the photolithography process. Recent improvements to these lasers have increased power levels from 60 W to 120 W. Consequently, the high-UV energy and high pulse power density in these lasers is apt to cause the damage of laser-windows made from CaF2 after short exposure times. Low loss, laser-durable, and long-lifetime CaF2 laser optics are required for the next generation of high-power lasers. Corning identifies the process of fabricating and testing improved CaF2 optics, sharing results from an extended R&D effort devoted to improving laser damage resistance of optical components. Additionally, this article describes how the next generation of crystalline materials are positioned to play a vital role in the laser optics and semiconductor manufacturing industry.
Key Technologies: Optics Fabrication, DUV Lithography, Chip Fabrication, ArF Excimer Lasers, Excimer Lasers, High-Threshold Optics, Optical Materials (CaF2), Industrial X-Ray, Plasma Cleaning
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