Craig Ciesla Named VP of Engineering by Kaiam

Hybrid photonic integrated circuit (PIC) developer Kaiam Corp. has appointed Craig Ciesla vice president of engineering. Ciesla will lead development and engineering teams at the company’s Newark, Calif., and Livingston, Scotland, sites, with a focus on advanced components and packaging for transceivers at 100 and 400 Gb/s and beyond.

Ciesla was CEO and cofounder of Tactus Technology, a venture-backed company that developed a tactile layer that creates dynamic physical buttons for touchscreen devices. He holds a bachelor’s degree and Ph.D. in physics from Heriot-Watt University.





LATEST NEWS

• EO Frequency Comb Design Broadens Bandwidth and Uses Less Power
  Jan 31, 2025
• IHMA Rebrands to IOTA: Week in Brief: 1/31/25
  Jan 31, 2025
• SPIE Names 2025 Prism Award Winners
  Jan 30, 2025
• Miniature Sensor Detects Spectral Signature via Optoelectronic Interface
  Jan 30, 2025
• Planet Signs $230 Million Agreement for High-Res Satellites
  Jan 30, 2025
• iPronics Raises $21M Series A
  Jan 29, 2025
• Max-IR Labs Takes Top Prize at 2025 SPIE Startup Challenge
  Jan 29, 2025
• Alice & Bob Close $104M Funding Round
  Jan 29, 2025