Search
Menu
Meadowlark Optics - Wave Plates 6/24 LB 2024

Die-to-Wafer Bonding Activation Solution

EV Group (EVG)Request Info
 
Facebook X LinkedIn Email
Die-to-Wafer Bonding Activation SolutionThe EVG®320 D2W die preparation and activation system from EV Group GmbH is a hybrid die-to-wafer bonding activation solution designed to speed the deployment of 3D heterogeneous integration.

Providing seamless integration with third-party die bonders, the system incorporates all critical pre-processing modules needed for D2W bonding including cleaning, plasma activation, die alignment verification, and other essential metrology applications. It can be operated as a standalone or integrated system.

It enables new generations of devices and systems such as high-bandwidth memory, logic-on-memory, chiplets, segmented and 3D system on chip devices, and 3D stacked backside illuminated CMOS image sensors.



Published: January 2021
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:


When you click "Send Request", we will record and send your personal contact information to EV Group (EVG) by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

ProductsDie-to-Wafer Bonding Activation SolutionEVG320D2WEV GroupImagingSensors & DetectorsCMOSWafersEurope

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.