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Bristol Instruments, Inc. - 872 Series LWM 9/25 LB

Wafer Waste Reduction: Femtum's Laser Trimming Redefines Photonic Circuit Yield and Performance

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Author: Robert Baribault, Jean-Philippe Bérubé, Simon Duval, and Louis-Rafael Robichaud
Tuesday, September 9, 2025
Femtum

A novel post-fabrication correction technique promises to break the manufacturing bottleneck hindering the next generation of photonic integrated circuits (PICs) for AI, telecommunications, and quantum computing. The laser-based process achieves p-shifts with less than 0.1 dB of additional loss.

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File: Femtum_From_Waste_to_Wafer_.pdf (4.61 MB)
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fiber opticsintegrated photonicsmanufacturing yieldphotonic integrated circuitssemiconductor manufacturingsilicon photonicswafer testingAILaserslaser trimmingwafer correctionpost-fabrication correction
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