About This Webinar
Laser drilling and beam steering technologies are increasingly vital in electronics and semiconductor manufacturing, particularly for applications requiring high precision and miniaturization. In electronics, traditional spindle drilling is unsuitable for High Density Interconnects (HDI), where via diameters are typically under 150µm, due to issues like tool breakage and deflection.
In the semiconductor domain, the demands are even more stringent. After circuit fabrication on a wafer, testing is performed using probe cards that require not only extremely small holes but also precise taper profiles. Precession laser drilling enables the creation of holes with positive, negative, or zero taper, meeting these exacting requirements.
Laser drilling also plays a key role in chiplet manufacturing. Chiplets—modular integrated circuits that form part of a larger System-on-a-Chip (SoC)—require substrates with intricate interconnects and vias. Among various fabrication methods, laser-based techniques with beam steering offer unmatched flexibility and precision for meeting these complex design needs.
*** This presentation premiered during the
2025 Photonics Spectra Micromachining Summit. For more information on Photonics Media conferences and summits, visit
events.photonics.com
About the presenter
Matthew Tedford is a software and controls product manager at Novanta, bringing over 15 years of experience in precision motion and laser-based applications. With a strong foundation as an applications engineer, Tedford has collaborated with a diverse range of customers across industries including marking and coding, additive manufacturing, converting, and micromachining. This hands-on experience has shaped a deep understanding of customer needs and technical challenges, enabling him to drive innovative product strategies and deliver impactful solutions in high-performance laser systems.