Hyperspectral Method Adds Speed, Accuracy to Wafer Inspection
SEOUL, South Korea, April 26, 2022 — A high-throughput metrology technique for semiconductor manufacturing, developed by Samsung Electronics, combines spectroscopy and imaging to measure in-cell uniformity (ICU) and in-wafer uniformity (IWU) of semiconductor devices used in high-volume manufacturing. The approach, called line-scan hyperspectral imaging (LHSI), measures semiconductor structures with speed, high spatial resolution, and high spectral resolution. It could provide a way to ensure accurate uniformity down to the