Through-Glass-Via Substrate Material
JNTCRequest Info
JNTC’s through-glass-via glass substrate is designed for AI and high-performance computing applications, providing flatness and thermal stability to reduce warpage and heat generation under high-speed processing. The substrates support various sizes and thicknesses and feature high precision via holes. The substrates support various sizes and thicknesses and feature high precision via holes. JNTC also developed etching, metalizing, and processing technologies, achieving yields >90% with minimal defects. Additional packaging features, such as alignment marks and cavities, have undergone performance tests.
https://thejntc.com
/Buyers-Guide/JNTC/c34557
Published: July 2025
From the Photonics Marketplace
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