Thermodynamic Microscopy Imaging Module
Hamamatsu CorporationRequest Info
Hamamatsu Photonics’ thermodynamic (TD) imaging module for its PHEMOS®-X series of high-resolution emission microscopes pinpoints failure locations in semiconductor devices with smaller and 3D structures, such as generative AI chips. The 670-nm light source module offers detections of weak light and heat emissions caused by device defects, with a 38× improved signal-to-noise ratio and data acquisition speeds of 90 seconds.
https://www.hamamatsu.com
/Buyers-Guide/Hamamatsu-Corporation/c5841
Published: June 2025
From the Photonics Marketplace
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