Modular Semiconductor Packaging Platform
Nova Ltd.Request Info
The Nova WMC from Nova is a modular platform for packaging in semiconductor manufacturing. Nova WMC can handle a wide range of wafer sizes and forms while supporting multiple metrology technologies in a modular manner. It works in both 2.5D and 3D advanced packaging processes and delivers solutions for industry inflection points, such as hybrid bonding. Nova WMC addresses major challenges such as high warpage, nonsymmetric shapes, and different surface conditions in a single tool, with high throughput, and fast, repeatable scanning with large-area mapping at nanometer fidelity.
https://www.novami.com
/Buyers-Guide/Nova-Ltd/c33012
Published: September 2025
From the Photonics Marketplace
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