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SC-955 PAD

About Universal Photonics Inc.

  • Type: Polishing Material and Pads
  • Density (g/cm3): 0.30 - 0.42
  • Removal Rate (µm/min): 0.68
  • Size Availability: Custom
  • PSA Backing: Yes

SC-955 PAD for High-Pressure Applications

SC-955 is the material of choice for applications where higher removal rates and consistent flatness are required. Key to SC-955’s superior performance is its tightly controlled pore structure. Small and consistent throughout the polyurethane architecture, the pores “meter” external polishing or finish slurries while supporting uniform points of contact between the pad and working surface.


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