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This Week in Photonics: Cognex Strikes Acquisition Deal; Imec Reports SWIR Imaging Advance (8/31/2023)

This Week in Photonics: Cognex Strikes Acquisition Deal; Imec Reports SWIR Imaging Advance
Weekly newsletter highlighting breaking news, technology developments and product releases in the photonics industry.
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Thursday, August 31, 2023
 
.: Top Stories

 
Imec Applies Pinned Photodiode Structure to Thin-Film SWIR Imager
Imec Applies Pinned Photodiode Structure to Thin-Film SWIR Imager
Engineers at imec have integrated a pinned photodiode (PPD) structure in thin-film image sensors. According to the researchers, the addition of a pinned-photogate and a transfer gate into the thin-film image sensor architecture exploits the superior absorption qualities of thin-film imagers — beyond 1 µm.
Read Article
 
Trio Partners to Commercialize Encapsulation on Perovskite Solar Cells
Trio Partners to Commercialize Encapsulation on Perovskite Solar Cells
Verde Technologies Inc., a pervoskite-focused thin-film solar company, has partnered with Northern Illinois University (NIU) and the U.S. Department of Energy’s National Renewable Energy Laboratory (NREL) to bring its perovskite solar cells to market.
Read Article
 
Line-Scan Raman Spectroscopy Detects Micro- and Nanoplastics
Line-Scan Raman Spectroscopy Detects Micro- and Nanoplastics
A line-scan Raman spectroscopy method developed by the Chinese Academy of Sciences and Cardiff University significantly boosts detection speed for both micro- and nanoplastics. The researchers reported a line-scan Raman microspectroscopy system capable of rapid imaging and chemical identification of microplastics down to 2000 nm in size, and capable of imaging a 40- × 10-µm particle in 10 s, representing a speed improvement by about two orders of magnitude compared to confocal imaging.
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.: More News

 

Cognex Acquires Machine Vision Optics Developer Moritex Corp.  Read Article 

Electro-Optic Modulator Integrated on Single-Mode Optical Fiber  Read Article 

Apollon, MIT to Collaborate on Noninvasive Glucose-Monitoring Technology  Read Article 

Quantum Light Source Generates Single Photons, Encodes Data  Read Article 

Tomography Techniques Recover Scattered Light to Speed 3D Imaging  Read Article 

 
.: Upcoming Webinars

 
Precision Automation Principles for the Optimal Testing and Packaging of PIC Devices Precision Automation Principles for the Optimal Testing and Packaging of PIC Devices
Thu, Sep 21, 2023 1:00 PM - 2:00 PM EDT
Production-scale testing of silicon photonic devices continues to be a challenge due to the multi-degree-of freedom, high-precision, optical alignments required for wafer- and die-level testing. Wide variances in chip designs and coupling features complicate test procedures, making it difficult to identify a system capable of producing repeatable measurements across various topologies. Brett Heintz of Aerotech Inc. provides a guide for selecting precision motion equipment to minimize the impact of positioning errors on optical alignment test results. Presented by Aerotech.
 Register Now 




The Past, Present, and Future of Optical Fiber The Past, Present, and Future of Optical Fiber
Tue, Sep 26, 2023 1:00 PM - 2:00 PM EDT
Hair-thin strands of glass, intrinsically transparent and strong, connect today’s world in ways that are unimaginable even 20 years ago. Over the past 50 years, glass optical fibers have advanced from passive low-loss conduits for light to active light-amplifying hosts to a myriad of nano-to-macro-structuring of core-clad combinations. John Ballato of Clemson University discusses this history as a looking glass into the future of optical fibers and its symbiosis with light to address the question: What can the next 50 years bring? Sponsored by Fibercore and Lumatec GmbH.
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CALL FOR ARTICLES!
Photonics Media is currently seeking technical feature articles on a variety of topics for publication in our magazines (Photonics Spectra, BioPhotonics, and Vision Spectra). Please submit an informal 100-word abstract to [email protected], or use our online submission form.

 
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