Advanced Packaging for Integrated Photonics: From Research to Manufacturing
Tue, Aug 29, 2023 10:00 AM - 11:00 AM EDT
Advanced packaging enables researchers to combine different technology platforms such as photonics, electronics, micro-electromechanical, and fluidics to address a vast array of exciting applications. Professor Peter O’Brien presents the packaging capabilities established by his research team at the Tyndall Institute, including details about the group's diverse range of research projects in areas such as telecommunications, quantum, and medical devices. The webinar outlines how these advanced packaging processes can be transferred to early-stage manufacturing through the group's leadership of the European Pilot Line, and discusses recent developments by the group to establish the European Photonics Academy to train industry and students in a wide range of advanced photonic technologies. Sponsored by Aerotech and PI (Physik Instrumente) LP.
Precision Automation Principles for the Optimal Testing and Packaging of PIC Devices
Thu, Sep 21, 2023 1:00 PM - 2:00 PM EDT
Production-scale testing of silicon photonic devices continues to be a challenge due to the multi-degree-of freedom, high-precision, optical alignments required for wafer- and die-level testing. Wide variances in chip designs and coupling features complicate test procedures, making it difficult to identify a system capable of producing repeatable measurements across various topologies. Brett Heintz of Aerotech Inc. provides a guide for selecting precision motion equipment to minimize the impact of positioning errors on optical alignment test results. Presented by Aerotech.
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