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Tuesday, November 4, 2025 |
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As photonic packaging advances through integrated and quantum photonics, efficient and precise fiber-to-chip connections are critical for high performance, low latency, and signal integrity. FEMTOPRINT, a leader in ultrafast laser microfabrication, addresses this need with high-precision glass microcomponents that combine design flexibility, engineering precision, and scalability.
This webinar explores FEMTOPRINT’s monolithic glass microconnectors, featuring passive fiber alignment structures, 3D optical waveguides, and micro-optical elements for compact and efficient light routing and coupling.
What you’ll learn:
- How glass microconnectors enable fiber-to-chip integration for advanced photonics
- The role of 3D waveguides and micro-optical elements in light routing and deflection
- How femtosecond laser micromachining supports scalable, high-accuracy manufacturing
Discover how glass microconnectors are shaping quantum photonics and co-packaged optics, helping meet performance and scalability demands for next-generation AI data centers.
Join Rolando Ferrini, Chief Product Officer, and Davide Lomellini, Sales Manager for North America at FEMTOPRINT, as they share how femtosecond laser micromachining is advancing photonic packaging. With extensive experience in photonics research, micro-optics, and precision manufacturing, they offer technical and commercial insights into scaling glass microdevices for cutting-edge applications.
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