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Key Suppliers

Zurich Instruments AG - Explore Nanoscale 6/24 MR

PowerPhotonic Ltd. - Bessel Beam Generator HP 6/24

22 products

Optical Fabrication Accessories

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HASTILITE MOV 850
Universal Photonics Inc.

Type: Polishing Material and Pads
Density (g/mL): 1.4 - 1.6
Particle Size D50 (μm): 0.3 - 0.5
Particle Size D99 (μm): < 2

Premier Product

UNIBOND 8.5 Thermoplastic Adhesive
Universal Photonics Inc.

Type: Adhesives
Color: Green
Melting Point (°C): 77 - 85
Penetration Test (in): 0.003 - 0.005

UNIBOND 6.5 Thermoplastic Adhesive
Universal Photonics Inc.

Type: Adhesives
Color: Orange
Melting Point (°C): 57 - 65
Penetration Test (in): 0.010 - 0.020

UNICER 1000 Cerium Polish
Universal Photonics Inc.

Type: Polishing Material and Pads
Appearance: Off White, Powder
Cerium Oxide Content (%): ≥ 58
Particle Size D50 (μm): 0.8 - 2.0

UNIBOND 5.0 Thermoplastic Adhesive
Universal Photonics Inc.

Type: Adhesives
Color: Purple
Melting Point (°C): 55 - 63
Penetration Test (in): < 0.004

1X2(2X2) P-M Fiber Coupler
Yangtze Optical Electronic Co. Ltd. (YOEC)

Type: Other
Operation temperature: ~40~+70 °C
Operation wavelength: 1310/1550 nm
Pigtail length: 1.0±0.2 m

EVERFLO Surfacing Additive
Universal Photonics Inc.

Type: Additives
Density (g/mL): 0.95 - 1.00
Freezing Point (°F): 26 - 28
pH: 6.4 - 8.6

3M TRIZACT Diamond Tile Abrasive Pad
Universal Photonics Inc.

Type: Abrasives
Available Grades (µ): 3, 6, 9
Customization: Yes
PSA Backing: Yes

X-59 Strip Coating
Universal Photonics Inc.

Type: Other
Color: Black
Full Dry Time (hr): 24
Size Availability: 1gl

CP PITCH for Continuous Polishing
Universal Photonics Inc.

Type: Polishing Pitch
CP55 Softening Point (°C): 52 - 55
CP64 Softening Point (°C): 68 - 72
CP73 Softening Point (°C): 77 - 80

SC-955 PAD
Universal Photonics Inc.

Type: Polishing Material and Pads
Density (g/cm3): 0.30 - 0.42
PSA Backing: Yes
Removal Rate (µm/min): 0.68

HASTILITE Poly Silicon Polish
Universal Photonics Inc.

Type: Polishing Material and Pads
Particle Size D50 (µm): 0.110 - 0.140
Particle Size D99 (µm): < 0.389
pH: 1 - 3

HASTILITE Nano Silicon Polish
Universal Photonics Inc.

Type: Polishing Material and Pads
% Solids: 15 - 20
Particle Size D50 (μm): 0.110 - 0.140
Particle Size D99 (μm): < 0.389

HASTILITE Ceria-Base Polish
Universal Photonics Inc.

Type: Polishing Material and Pads
Particle Count D50 (μm): 0.4 - 0.7
pH: 6 - 7
PO Density (g/mL): 1.50 - 1.68

Gugolz Polishing Pitch
Meller Optics Inc.

Type: Polishing Pitch
Burn Point: 278° to 252°
Flash Point: 246° to 213°
Melting Point: 72°C to 87°C

S3 Super Smooth Surfactant
Universal Photonics Inc.

Type: Additives
Appearance: Pale Blue Liquid
pH: 6.0 - 7.5
Size Availability: 1pt, 1gl, 5gl

Optical Positioning Epoxy - OP-81-LS
Dymax, Headquarters

Type: Adhesives
Durometer Hardness: D90
Elongation at Break, %: 2
Glass Transition, Tg °C: 153

Uniform Series Solid Glass Microspheres
Novum Glass LLC

Type: Other

DZr-P Zirconia Slurry
Demeter Technologies Inc.

Type: Polishing Material and Pads
Color: Pink
Concentration: 25%
D50 (µm): 1.4 - 1.6

Optical Display Adhesive - 9702
Dymax, Headquarters

Type: Adhesives
Durometer Hardness: 00-70
Elongation at Break, %: 137
Glass Transition Tg, °C: 1

Optical Alignment Adhesives - OP-60
Dymax, Headquarters

Type: Adhesives
CTE: 58 × 10 - 6 in/in/°C (58 ppm)
Durometer Hardness: D80
Elongation at Break, %: 2.4

Generation and Polish of Large Optics
Electrogrip

Type: Other

Optical Fabrication Accessories Products

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