The microPRO™ XS for OCF features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer.
Technologie-Campus 8
09126 Chemnitz
Germany
Phone: +49 371 40043 222
Fax: +49 371 40043 40