The Fully Automatic WSF4000 Laser Scriber is designed to scribe wafers as part of the scribe and break singulation process. The machine is equipped with a 355 nm laser that efficiently scribes Sapphire, GaN, or Si wafers to be cleaved into bars or chips. The design includes a vision system with automatic functions that accurately moves wafers to the cut position. In addition, the machine incorporates numerous features to ensure high performance safety and low cost of ownership.
100 Nogami
Miyamaki
Kyoto 610-0313
Japan
Phone: +1 415-317-4944