- Company: EpoxySet Inc.
- Type: Other
- CTE: 30 ppm/°C
- Glass Transition, Tg: 155 °C
- Volumetric Shrinkage: 0.015
- Durometer Hardness, Shore D: ≥85
- Elongation: 1.0%
- Viscosity: 65,000 cps
A true dual cure system - cured with UV energy or heat. Ideal for bonding shadowed areas and complicated configurations to eliminate the need for more than one adhesive. Halogen free system withstands 85/85 testing for 1000 hours with an exceptionally low water absorption rate. Produces excellent bond strength to PPS as well as polyimides, polyester film, LCPs and all elements in printed circuit boards.
718 Park East Lane
Woonsocket, RI 02865
United States
Phone: +1 401-726-4500