Fineplacer Lambda 2 Die Bonder

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Company: FINETECH GmbH & Co. KG
Type: Equipment
Placement accuracy: submicron
Guidance: software supported

This table top flip chip bonder can be easily configured for a wide range of applications for process development or prototyping.

FINETECH GmbH & Co. KG

Boxberger Str. 14
12681 Berlin
Germany

Phone: +49 3093 66810

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