High Throughput Reliability Verification and Test System for Volume Production
♦ Handles full wafers / panels / singulated die / modules for highest production throughput
♦ Identifies failing logic / memory / photonic die before final package integration
♦ Up to 18 Blades (slots) for wafer or panel testing using WaferPakTM contactors or 9 Blade
capability for wafers / singulated die / module DiePak® carriers
♦ Advanced high-power testing capability with up to 3,500 watts of power per wafer
400 Kato Terrace
Fremont, CA 94539
United States
Phone: +1 510-623-9400
Fax: +1 510-623-9450