- Company: Dymax, Headquarters
- Type: Adhesives
- Viscosity, cP (Nominal): 86,000
- Glass Transition, Tg °C: 184
- Volumetric Shrinkage, %: 1.1
- Durometer Hardness: D94
- Tensile @ Break MPa [psi]: 36.7 [5,328]
- Elongation at Break, %: 1.2
Low shrinkage camera module optical epoxy features very fast UV/Visible light cure with LED cure and low temperature 80-85 °C heat-cure capability. Moisture and thermal-cycle resistant, excellent depth of cure, and cold ship/cold storage 1-5 °C. Designed for active alignment, optical assembly, and camera module/lidar bonding. Recommended surfaces include LCP, PCB, PPS, FPC, and metallic surfaces.
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United States
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