- Company: Process Materials Inc.
- Type: Sputtering Targets
- Applications: Biomedical/Medical, Communications, Industrial, Other
- Shapes: Variable Sizes, Shapes and Geometries
- Materials Used: Oxygen-free, High Conductivity (OFHC) Copper, Molybdenum, Titanium, Aluminum (Alloys) and Stainless Steel
Backing plates are used to mount the target in the sputtering system, so their selection is critical. Process Materials manufactures standard and custom designs to suit your specific sputtering process.
269 Technology Way, B6
Rocklin, CA 95765
United States
Phone: +1 925-245-9626
Fax: +1 925-245-9629