Silicon Photonics (SiP) means photonic devices are now being fabricated alongside microelectronics on silicon wafers. This requires new testing and packaging methods to deal with nanoscale alignments across multiple input and output channels.
What used to be a slow, lengthy process can now be achieved with high throughput. PI’s award-winning Fast Multi-Channel Photonics Alignment Engines (FMPA) are based on a faster hybrid alignment engine and firmware based ultra-fast alignment algorithms.
Alignment in Up to 6 Degrees of Freedom – up to 18 Axes.
The alignment algorithms with optical feedback is implemented in the E-712 controller’s modular firmware to enable fast, simultaneous alignment and tracking of multichannel couplings in multiple degrees of freedom. A broad variety of coarse/fine mechanisms can be used, enabling a spectrum of applications from undiced wafer to final package. Long-travel, closed-loop piezo nanopositioners ensure high throughput and reliable reproducibility. High-precision stage stack or hexapod options accommodate any application up to 6 DOFs per coupling.
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