- Company: UniversityWafer Inc.
- Type: Wafers
- Diameter / Dimension: 5mm - 300mm
- Applications: Astronomy, Biomedical/Medical, Communications, Industrial, Military, Scientific Research, Other
- Diameter: 100 mm
- Thickness: 500 µm
- Polish: DSP
- Scratch/Dig: 60/40
Fused silica wafers. Buy as few as one wafer.
11 Elkins St., Suite 330
South Boston, MA 02127
United States
Phone: +1 800-713-9375
Fax: +1 888-832-0340