Submicron die bonders for photonics packaging, assembly, and die attach. Bonding of laser bars and diodes, VCSELs, silicon photonics, sensors, flip chip, LEDs, transceivers, and lidar devices. Systems provide high-process flexibility in one platform; manual, motorized, and automated models for a variety of bonding applications.
Established: 1992
Ownership type: Privately Owned