Precision machining of hard, brittle materials including glass, quartz, sapphire, alumina, silicon carbide, and other technical ceramics. Ultrasonic machining, glass machining, and CNC machining. Single- and double-sided polished borosilicate wafers. Prototype through production. Advanced metrology capabilities. AS9100 certified.
Established: 1971
Employees: 150
Facility area (sq ft): 150,000
Ownership type: Privately Owned